MANUFACTURERS AND DESIGNERS OF:
Electronic Manufacturing Chemicals and Solders for PC Board Manufacturing

• Lead-free Materials
• Die Attach
• Underfills
• Encapsulants
• Chip-On-Board Glob
• Non-Conductive Pastes
• Semiconductor Molding Compounds
• Optoelectronic Materials
• Electronic Coating Powders
• Phase Change Thermal Interface Materials
• Thermal Management Adhesives
• Solder & Flux Materials
• Surface Mount Adhesives
• Electrically Conductive Adhesives
• Ciruit Board Protection
• Low Pressure Molding
• Solution Circuit Board
• Underfills & Encapsulants

The Manufacturing process wherein individual electrical or electronic components are protected and made ready for connection through external leads.

• Lead-Free Solutions
  Henkel Loctite has responded to the increasing need for environmentally friendly packaging and assembly solutions with a full range of new materials. As the microelectronics industry works toward eliminating lead from its products and processes, Henkel Loctite has developed not only the material technology to meet that need, but also provides the technical and engineering support crucial to process engineers as they face the unique processing requirements of lead-free operations. This includes lead-free solder, as well as die attach, mold compounds, underfill, and liquid encapsulants for semiconductors and other components.
  
  
• Hysol Die Attach Adhesives
  Hysol die attach adhesives allow customers to improve BLT consistency and reduces cost by eliminating the need for a dummy die and additional bonding steps in stacked die packages. These spacers provide consistent bond lines of 2,3,4 or 6 mils depending on your specific bond line requirments.
  
  
• Hysol Underfills
  Used in devices such as FC CSPs and FC BGAs for ASICs, chipsets, graphics chips, digital processors, and microprocessors. These fast flow materials permeate easily under large die. Offering excellent adhesion when used with a variety of no clean fluxes, these underfills will not crack after thermal shock or thermal cycling.
  
  
  • Package Level Underfills
  • CSP and DCA Underfill Encapsulants
    
    
• Hysol Encapsulants
  These products cure to form void-free globs when exposured to heat with formulations for low CTE, minimizing stress on wire bonds during thermal cycling.
  
  
  • Hysol Semiconductor Liquid Encapsulants
  • Hysol Chip On Board Liquid Encapsulants
    
    
• Electronic Molding Compounds
  Hysol Electronic Molding Compounds protect passive components, such as ceramic and tantalum capacitors and resistors, and are designed for both automolds and conventional molds.
  
  
• Hysol Semiconductor Molding Compounds
  Hysol Semiconductor Molding Compounds provide low stress low water absorption and high physical strength for the most demanding application areas - from descrete/power devices to array packages.
  
  
• Hysol Optoelectronic Materials
  Hysol optoelectronic encapsulants provide good moisture resistance, good thermal shock characteristics, and excellent color stability at t elevated temperatures.
  
  
• Hysol Electronic Coating Powders
  These materials are designed for dispensing through a full range of powder application equipment. Standard fluid bed machines, including small manual, or large fully automated equipment, apply powder with minimal dusting in cascade machines, powders transport well and coat thoroughly.

Providing materials solutions for key market segments within the electronics industry. From semiconductors to cell phones and engine control modules to smart cards, our materials contribute to the reliability and miniaturization of all circuit boards used in these products.

• Hysol Photonic Adhesives & Sealants
  Loctite provides the most comprehensive product line available to manufacturers and designers of optical systems. We offer a diverse range of adhesives, sealants, coatings, customized product formulations, and engineering/technical services.
  
  
• Automotive Electronics Market Solutions
  Electronic components and modules in today's vehicles are more advanced than ever before, and they continue to expand in scope and complexity. As such, these devices require a variety of advanced adhesives for innovative applications.
  
  
  • Automotive Electronics PCB Assembly
    
  • Automotive Electronics Microelectronics(COB)
  • Automotive Electronics PCB Protection

The attachment of prepackaged individual components, to printed circuit boards, to make systems and sub assemblies.

• Thermal Management Adhesives
  Loctite Thermally Conductive Adhesives eliminate the need for mechanical fasteners and eliminate the need for mechanical fasteners and clips while providing an efficient method of thermal transfer between heat generating electronics devices and their heat sinks
  
  
  • Loctite Thermal Adhesives
  • Loctite Thermal Potting compounds
  • Loctite Phase Change Thermal Interface.
    
    
• Multicore Solder Materials
  The Multicore line of solder pastes is designed to meet there rigorous demands of variety of electronic Manufacturing soldering process. Whether your process requires long abandon time, wide process windows, or high-speed printing. Henkel Loctite offers a multicore paste to suite your needs.
  
  
  • Multicore Lead-free Solutions
  • Multicore No-Clean Solder Pastes
  • Multicore No-Clean VOC Liquid Fluxes
  • Multicore No-Clean VOC-Free Fluxes
  • Multicore Water Wash Fluxes - IPA Based
  • Multicore Cored Wire
  • Multicore Cleaners
  • Multicore Thinners
    
    
• Loctite Chipbonder Surface Mount Adhesives
  
  
  • Loctite Chipbonder Syringe Dispense Adhesives
  • Loctite Chipbonder stencil print/pin Transfer Adhesives
  • Adhesive Clean Up Solvent
    
    
• Loctite Electrically Conductive Adhesives
  for Board Level Assembly
  Loctite Electrically Conductive Adhesives provide both a mechanical bond and an electrical interconnection between a device and a circuit board. Loctite electrically conductive adhesives meet the industry's need for lead-free alternatives to solder.
  
  
  • Loctite Electrically Conductive Isotropic Epoxy Adhesives
  • Loctite Electrically Conductive Silicones
  • Adhesive Clean Up Solvent
    
    
• Circuit Board Protection
  Printed circuit boards are used in a wide range of new applications exposing them to harsh environmental conditions. Henkel Loctite is committed to meeting the industry's need for materials that provide superior environmental and thermal cycling protection.
  
  
  • Potting/Encapsulation
  • Sealing/Gasketing
  • Conformal Coatings